Epoxy resins are widely used as insulation material in electrical and electronic applications. They are employed as adhesives, sealants, coatings, impregnants, moldings and potting compounds to produce void-free insulation around components. The selection of a specific epoxy formulation for a given application requires not only an understanding of desirable dielectric properties, but also many other characteristics such as physical and mechanical strength, chemical resistance, operating temperature range and thermal cycling, dimensional stability and resistance to shock and vibration.

Epoxy resins for electrical and electronic applications can be divided into two general categories: epoxies with amine type curing agents and those coupled with anhydride curing systems. Epoxy resin systems that contain amine are most frequently employed as adhesives, sealants, impregnants and coatings. Anhydride epoxy compounds are primarily employed for encapsulation and potting purposes, especially for applications which have high temperature demands or large volume usage.